By Florian Solzbacher (auth.), Dr. Jürgen Valldorf, Dr. Wolfgang Gessner (eds.)
Microsystems are a massive issue that give a contribution to an vehicle model's luck. to satisfy the customers's hope for security, comfort and car financial system, and to fulfill environmental criteria, microsystems are the serious issue. Microsystems purposes (MST) have already led to enhanced functionality and higher price for cash. however the advances carried out exhibit in basic terms the start of a revolution within the car region, which goals at an entire transition from the automatically pushed motor vehicle method to a robotically established yet ICT-driven method. the chosen contributions from AMAA 2003 deal with safeguard (both preventive and protective), powertrain (online dimension and keep watch over of engine and transmission subsystems), convenience and HMI (systems to reinforce the relief of passengers and human computer interface issues), and networked motor vehicle (all facets of intra motor vehicle platforms and ambient communique networks). chosen lawsuits for the 7th convention on microsystems within the automobile area, a standard occasion now with progressively more individuals on a contemporary and promising box occurring in Berlin in may possibly 2003.
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Extra resources for Advanced Microsystems for Automotive Applications 2003
10, p. 564, 1969 E. Obermeier, „Anodic wafer bonding“, Proc. 3rd Int. Symp. on Semicond. Wafer Bonding: Sience, Technology and Applications, vol. 95-7, The Electrochem. Society, Pennington, NJ, p. 212, 1995 A. D. Brooks, et. al, „Low temperature electrostatic silicon-to-silicon seals using sputtered borosilicate glass“, J. Electrochem. , vol. 119, no. 4, p. 545, 1972 P. Krause, et. al, „Silicon to Silicon Anodic Bonding Using Evaporated Glass“, Digest of Techn. Papers, Int. Conf. Solid-State Sensors and Actuators, Stockholm, Sweden, p.
2, 2001 J. J. Leon, et. al, „Mikrosystem technology of chemical and biological microreactors“, DECHEMA Monographs, vol. 132, no. 51, 1996 J. F. Niklaus, „Low temperature full wafer adhesive bonding“, J. Micromech. , vol. 11, no. 2, p. 100, 2001 J. F. Niklaus, „Void-free full-wafer adhesive Bonding“, Proc. 13th IEEE Int. , Myjazaki, Japan, 2000, p. 247 W. H. Ko, et. al, „Bonding techniques for micorsensors“, in Micromachining and Micropackaging of Transducers“, C. D. Fung, P. W. Cheung, W. H. Ko, and D.
53, no. 10, p. 564, 1969 E. Obermeier, „Anodic wafer bonding“, Proc. 3rd Int. Symp. on Semicond. Wafer Bonding: Sience, Technology and Applications, vol. 95-7, The Electrochem. Society, Pennington, NJ, p. 212, 1995 A. D. Brooks, et. al, „Low temperature electrostatic silicon-to-silicon seals using sputtered borosilicate glass“, J. Electrochem. , vol. 119, no. 4, p. 545, 1972 P. Krause, et. al, „Silicon to Silicon Anodic Bonding Using Evaporated Glass“, Digest of Techn. Papers, Int. Conf. Solid-State Sensors and Actuators, Stockholm, Sweden, p.